Ribbon bonding ground plane for radio frequency performance improvement in electro-optical devices

ABSTRACT

In some implementations, an electro-optical device includes a first substrate including a first ground pad and a first signal pad; a second substrate including a second ground pad and a second signal pad, wherein the first signal pad and the second signal pad form a signal pad pair, wherein the first substrate is separated from the second substrate by less than a threshold amount; wherein the first substrate is configured to receive an optical component and the second substrate is configured to receive an electrical component that is couplable to the optical component via a wire bonding between the first signal pad and the second signal pad; and a planar ribbon bonding connecting the first ground pad to the second ground pad and diagonally crossing the wire bonding.

CROSS-REFERENCE TO RELATED APPLICATION

This patent application claims priority to U.S. Provisional PatentApplication No. 63/355,366, filed on Jun. 24, 2022, and entitled “WIREBONDING INTERCONNECTION BETWEEN COPLANAR STRUCTURES.” The disclosure ofthe prior application is considered part of and is incorporated byreference into this patent application.

TECHNICAL FIELD

The present disclosure relates generally to electro-optical devices andto a ribbon bonding ground plane for radio frequency performanceimprovement in electro-optical devices.

BACKGROUND

Electro-optical devices may include components disposed on multipledifferent substrates. For example, integrated circuits, opticalemitters, controllers, and/or other components may be disposed ondifferent substrates within an electro-optical device. Electricalconnection between different components on different substrates may beachieved using bond wires. For example, a bond wire may connect anoutput of a controller to an input of an optical emitter to enable thecontroller to control the optical emitter. This may enable connectionbetween the different components without manufacturing a new substrateto support the different components, thereby providing flexibility indesign of electro-optical devices. Bond wires may introduce inductanceat high radio frequencies. The inductance may be based on a bond wirediameter, a bond wire material, a bond wire length, a frequency ofoperation, a height that the bond wire reaches above one or moresubstrates, or a separation between pairs of bond wires, among otherexamples.

SUMMARY

In some implementations, an electro-optical device includes a firstsubstrate including a first set of ground pads and a first signal paddisposed between a first ground pad and a second ground pad of the firstset of ground pads; a second substrate including a second set of groundpads and a second signal pad disposed between a third ground pad and afourth ground pad of the second set of ground pads, wherein the firstground pad is aligned to the third ground pad to form a first ground padpair, the second ground pad is aligned to the fourth ground pad to forma second ground pad pair, and the first signal pad is aligned to thesecond signal pad to form a signal pad pair; a set of wire bondingsincluding a first wire bonding connecting the first ground pad pair, asecond wire bonding connecting the second ground pad pair, and a thirdwire bonding connecting the first signal pad and the second signal pad;an optical emitter associated with the first substrate and electricallyconnected to an electrical signal component associated with the secondsubstrate via the third wire bonding; and a planar ribbon bondingconnecting the first ground pad to the fourth ground pad, wherein theplanar ribbon bonding crosses the third wire bonding without contactingthe third wire bonding.

In some implementations, an electro-optical device includes an opticalemitter disposed on a first substrate; and a signal controller for theoptical emitter disposed on a second substrate, wherein the firstsubstrate and the second substrate include at least one ground pad pairconnected by a corresponding at least one ground pad wire bonding,wherein the first substrate and the second substrate include at leastone signal pad pair connected by a corresponding at least one signal padwire bonding and electrically connecting the optical emitter to thesignal controller, and wherein the first substrate and the secondsubstrate are connected by at least one planar ribbon bonding from atleast one first ground of the first substrate to at least one secondground of the second substrate such that the at least one planar ribbonbonding crosses the at least one signal pad wire bonding.

In some implementations, an electro-optical device includes a firstsubstrate including a first ground pad and a first signal pad; a secondsubstrate including a second ground pad and a second signal pad, whereinthe first signal pad and the second signal pad form a signal pad pair,wherein the first substrate is separated from the second substrate byless than a threshold amount; wherein the first substrate is configuredto receive an optical component and the second substrate is configuredto receive an electrical component that is couplable to the opticalcomponent via a wire bonding between the first signal pad and the secondsignal pad; and a planar ribbon bonding connecting the first ground padto the second ground pad and diagonally crossing the wire bonding.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B are diagrams of an example electro-optical device associatedwith a ribbon bonding ground plane.

FIGS. 2A-2E are diagrams of an example layouts-240 of an electro-opticaldevice associated with a ribbon bonding ground plane.

FIG. 3 is a diagram of an example electro-optical device associated witha ribbon bonding ground plane.

FIGS. 4A-4C are diagrams of an example responses of exampleelectro-optical devices with and without a ribbon bonding ground

DETAILED DESCRIPTION

The following detailed description of example implementations refers tothe accompanying drawings. The same reference numbers in differentdrawings may identify the same or similar elements.

Bond wires connecting electro-optical components disposed on differentsubstrates can induce inductance when used for high radio frequency (RF)operations. This inductance, which may be referred to as “parasiticinductance” can be reduced by minimizing a separation between thesubstrates, thereby reducing a length of the bond wires, which may alsobe referred to as “wire bondings.” For example, a first substrate, ontowhich a first component is attached, may be coplanar with a secondsubstrate, onto which a second component is attached, and a wire bondingmay cross a gap between the first and second substrate. In someexamples, the wire bonding may extend both vertically and laterally. Inother words, rather than a wire bonding being coplanar with thesubstrates, the wire bonding may extend up above a surface of thesubstrates (and components thereon) forming an arched or rectangularprofile or cross-section.

Reduction of the parasitic inductance can be achieved by disposing aground plane below the wire bonding. For example, a grounded metal layermay be disposed coplanar with and between a first substrate and a secondsubstrate and a wire bonding may extend upward from the first substrateand the second substrate above the ground plane. However, to attach theground plane layer to, for example, grounded pads of the first substrateand the second substrate, the first substrate and the second substratemay have additional separation, which may extend a length of the wirebonding. Additionally, or alternatively, a shim may be attached betweenthe substrates with a conductive epoxy or a welding connection to enablemanufacture of the ground plane layer. However, adding a shim and aconductive connection may add manufacturing complexity and make highvolume manufacturing difficult.

Rather than a monolithic grounding layer, a grounding ribbon can bedisposed under the wire bond to reduce parasitic inductance. Forexample, the grounding ribbon and the wire bonding are colinear betweenthe first substrate and the second substrate. Because the groundingribbon is wider than the wire bonding, the grounding ribbon forms agrounding plane beneath the wire bonding. However, positioning agrounding ribbon colinear with a wire bonding results in additionalseparation between the substrates which increases parasitic inductance.This may reduce a benefit (e.g., an amount of parasitic inductancereduction) that is achieved by disposing the grounding ribbon under thewire bond.

Some implementations described herein provide a ribbon bonding groundplane that is not colinear with a wire bonding. For example, the ribbonbonding may extend from a first ground pad on a first substrate and on afirst side of a wire bonding to a second ground pad on a secondsubstrate and on a second side of the wire bonding. In this case, theribbon bonding crosses the wire bonding rather than being colinear withthe wire bonding. Based on the ribbon bonding crossing the wire bondinga separation between the first substrate and the second substrate can bereduced relative to a colinear ribbon bonding, thereby reducing a lengthof the wire bonding. Based on reducing a length of the wire bonding andthe ribbon bonding providing a ground plane for the wire bonding,implementations described herein reduce parasitic inductance relative toother techniques for connecting multiple substrates for high RFoperations.

FIGS. 1A-1B are diagrams of an example electro-optical device 100associated with a ribbon bonding ground plane. As shown in FIGS. 1A-1B,electro-optical device 100 includes a first substrate 110 and a secondsubstrate 120. The first substrate 110 includes a first ground pad 112,a second ground pad 114, and a first signal pad 116. The secondsubstrate 120 includes a third ground pad 122, a fourth ground pad 124,and a second signal pad 126.

In some implementations, first substrate 110 may be coplanar with secondsubstrate 120. For example, first substrate 110 and second substrate 120may have approximately coplanar surfaces onto which approximatelycoplanar bond pads are disposed (e.g., the ground pads and the signalpads). In some implementations, first substrate 110 may be separatedfrom second substrate 120 by less than a threshold amount. For example,based at least in part on using a crossing ribbon connector rather thana colinear ribbon connector, as described in more detail herein, aseparation between first substrate 110 and second substrate 120 may beless than 400 micrometers (μm), less than 200 μm, less than 100 μm, lessthan 50 μm, less than 25 μm, less than 10 μm, or less than 5 μm, amongother examples.

As further shown in FIG. 1A, the first substrate 110 may connect to thesecond substrate 120 via a set of wire bondings, which may also bereferred to as “wire bonds.” For example, first ground pad 112 mayconnect (e.g., via a first wire bonding 130-1) to third ground pad 122to form a first ground pad pair, second ground pad 114 may connect(e.g., via a second wire bonding 130-2) to fourth ground pad 124 to forma second ground pad pair, and first signal pad 116 may connect (e.g.,via a third wire bonding 130-3) to second signal pad 126 to form asignal pad pair. The signal pad pair may enable electrical connectionbetween electro-optical components (not shown), such as an opticalemitter, a controller, or a power source, among other examples, ofelectro-optical device 100.

As further shown in FIG. 1A, first substrate 110 may connect to secondsubstrate 120 via a ribbon bonding 140. The ribbon bonding 140 mayconnect between non-paired ground pads, such that the ribbon bonding 140crosses wire bonding 130-3 without making contact with wire bonding130-3 (and without crossing wire bonding 130-1 or wire bonding 130-2).By arranging ribbon bonding 140 in a diagonal arrangement, as shown,ribbon bonding 140 extends a greater distance than in a colineararrangement. In other words, a distance between third ground pad 122 andsecond ground pad 114 is greater than a distance between signal pad 116and signal pad 126. Accordingly, when, to achieve manufacturability, theribbon bonding 14 is to be associated with at least a particular length,the particular length is achieved in a diagonal arrangement with lessseparation between first substrate 110 and second substrate 120 than isachieved in a colinear arrangement. In this case, ribbon bonding 140grounds an electrical inductance (e.g., a parasitic inductance)associated with high RF operation of components of electro-opticaldevice 100 that are connected via the signal pad pair and wire bonding130-3. In this way, based on ribbon bonding 140 connecting betweennon-paired ground pads, a minimum ribbon bonding length (e.g., formanufacturability) can be achieved with less separation than if ribbonbonding 140 were to be colinear with wire bonding 130-3.

As shown in FIG. 1B, and by side-view diagram 150, ribbon bonding 140may be disposed below wire bonding 130-3. In another example, ribbonbonding 140 may be disposed above wire bonding 130-3. In anotherexample, ribbon bonding 140 may be disposed both above and below wirebonding 130-3. In other words, a first ribbon bonding 140 may bedisposed above wire bonding 130-3 and a second ribbon bonding 140 may bedisposed below wire bonding 130-3. In this case, disposing ribbonbonding 140 both above and below wire bonding 130-3 achieves improvesS11 and S21 performance, as described herein.

As further shown in FIG. 1B, and by diagram 160, ribbon bonding 140 maybe a planar ribbon bonding. For example, ribbon bonding 140 may have arectangular cross-section with a width (W) and a thickness (T). Incontrast, wire bonding 130-3 may have a circular cross-section with adiameter (D). In some implementations, the ribbon bonding 140 may haveat least a threshold aspect ratio (e.g., a ratio of the width to thethickness). For example, the ribbon bonding 140 may have an aspect ratioof at least 2 (e.g., a width to thickness ratio of at least 2:1), atleast 4, at least 8, at least 16, at least 32, at least 64, at least128, or at least 256, among other examples. In some implementations, theribbon bonding 140 may have a width of approximately 50 μm and athickness of approximately 6 μm. Reducing a thickness of the ribbonbonding 140 may enable the ribbon bonding 140 to remain lower aboverespective surfaces of the first substrate 110 and the second substrate120, thereby reducing a likelihood of contacting wire bonding 130-3 andshort circuiting wire bonding 130-3. In some implementations, a ratio ofthe width of ribbon bonding 140 to the diameter of wire bonding 130-3may be at least 4, at least 8, at least 16, at least 32, at least 64, atleast 128, or at least 256, among other examples. In this way, ribbonbonding 140 forms a ground plane for wire bonding 130-3, therebyreducing parasitic inductance for wire bonding 130-3.

In some implementations, ribbon bonding 140 may have a particularstructure and/or a particular material. For example, ribbon bonding 140may be a flexible ribbon connector that includes a metallic material. Insome implementations, ribbon bonding 140 may include a cladding material(e.g., a dielectric material or an insulator material). Additionally, oralternatively, ribbon bonding 140 may be a rigid ribbon connector. Insome implementations, ribbon bonding 140 is non-insulated. For example,ribbon bonding 140 may be formed from bare ribbon wire. In this case,ribbon bonding 140 may have an air gap (or other non-conductive mediumgap, such as another gas) separating ribbon bonding 140 from wirebonding 130-3. Alternatively, ribbon bonding 140 may be insulated. Forexample, ribbon bonding 140 may be a ribbon connector coated with aninsulative material. In this case, the insulated material may preventribbon bonding 140 from touching wire bonding 130-3, thereby enablingribbon bonding 140 to be positioned closer to wire bonding 130-3 (e.g.,without risk of electrically grounding wire bonding 130-3 as a result ofaccidental touching) and further reduce parasitic inductance (e.g., bybeing positioned closer together).

As indicated above, FIGS. 1A-1B are provided as an example. Otherexamples may differ from what is described with regard to FIGS. 1A-1B.

FIGS. 2A-2E are diagrams of an example layouts 200-240 of anelectro-optical device associated with a ribbon bonding ground plane. Asshown in FIG. 2A, in a first example layout 200, the electro-opticaldevice includes two signal pad pairs (S), rather than the single signalpad pair in FIGS. 1A-1B, and two ground pair pads (G) in aground-signal-signal-ground (GSSG) coplanar structure arrangement. Inthis example, a single ribbon bonding extends from a first ground pad ona first side of the two signal pad pairs to a second ground pad on asecond side of the two signal pad pairs, such that the single ribbonbonding crosses the two wire bondings for the two signal pad pairs. Inthis case, the single ribbon bonding serves as a ground plane for thetwo wire bondings, as shown.

As shown in FIG. 2B, in a second example layout 210, the electro-opticaldevice includes three ground pad pairs and two signal pad pairs arrangedin an alternating ground-signal-ground-signal-ground (GSGSG) coplanarstructure arrangement. In this case, two ribbon bondings are provided tocross the two wire bondings for the two signal pad pairs. For example, afirst ribbon bonding crosses from a first ground pad (on the firstsubstrate) of a first ground pad pair to a second ground pad (on thesecond substrate) of a second ground pad pair. Similarly, a secondribbon bonding crosses from a third ground pad (on the first substrate)of a third ground pad pair to the second ground pad (on the secondsubstrate) of the second ground pad pair. In other words, the ribbonbondings are bonded to a common ground pad (the second ground pad on thesecond substrate), in this example.

In contrast, as shown in FIG. 2C, in a third example layout 220, ratherthan two ribbon bondings sharing a common ground pad, the two ribbonbondings do not share a common ground pad (and extend parallel betweenthe first substrate and the second substrate to cross respective wirebondings of respective signal pad pairs). In other words, the firstribbon bonding extends from a first ground pad on the first substrate toa second ground pad on the second substrate, crossing a first wirebonding for a first signal pad pair. Further, the second ribbon bondingextends from a third ground pad on the first substrate to a fourthground pad on the second substrate, crossing a second wire bonding for asecond signal pad pair.

As shown in FIG. 2D, in a fourth example layout 230, rather thanparallel ribbon bondings (as in FIG. 2C) or ribbon bondings meeting at acommon ground pad (as in FIG. 2B), ribbon bondings may cross, in someimplementations. For example, a first ribbon bonding may extend from afirst ground pad on the first substrate to a second ground pad on thesecond substrate and a second ribbon bonding may extend from a thirdground pad on the first substrate to a fourth ground pad on the secondsubstrate. In this case, the first ribbon bonding crosses the secondribbon bonding and both the first ribbon bonding and the second ribbonbonding cross the wire bonding associated with the signal pad pair. Inthis way, additional ribbon bonding surface area may be present at thecrossing with the wire bonding (e.g., present underneath the wirebonding, present above the wire bonding, or one being present underneathand one being present above the wire bonding). For example, as shown,the first ribbon bonding and the second ribbon bonding cross underneaththe wire bonding. In another example, both the first ribbon bonding andthe second ribbon bonding may cross above the wire bonding. In anotherexample, the first ribbon bonding may pass underneath the wire bondingand the second ribbon bonding may pass above the wire bonding (and crossthe first ribbon bonding, thereby sandwiching the wire bonding betweenthe first ribbon bonding and the second ribbon bonding). By havingadditional ribbon bonding surface area present at the crossing, anamount of parasitic inductance can be further reduced relative to havingless ribbon bonding surface area present at the crossing.

As shown in FIG. 2E, in a fifth example layout 240, rather than havingground pad pairs, the electro-optical device may have non-paired groundpads. For example, the first substrate may have a first ground pad on afirst side of a first signal pad and the second substrate may not have aground pad aligned to the first ground pad on the same first side of asecond signal pad. Similarly, the second substrate may have a secondground pad on a second side of the second signal pad and the firstsubstrate may not have a ground pad aligned to the second ground pad onthe same second side of the first signal pad. In this case, the ribbonbonding extends from the first ground pad to the second ground pad,crossing the wire bonding of the signal pad pair, as shown.

As indicated above, FIGS. 2A-2E are provided as an example. Otherexamples may differ from what is described with regard to FIGS. 2A-2E.It is contemplated that different quantities of signal pads, groundpads, ribbon connectors, and wire bondings may be possible than what isshown in, for example, FIGS. 2A-2E.

FIG. 3 is a diagram of an example electro-optical device 300 associatedwith a ribbon bonding ground plane. FIGS. 4A-4C are diagrams of examples400 of responses of example electro-optical devices with and without aribbon bonding ground. As shown in FIG. 3 , electro-optical device 300includes a first substrate 310 and a second substrate 320. The firstsubstrate 310 includes a first ground pad 312, a second ground pad 314,and a first signal pad 316. The second substrate 320 includes a thirdground pad 322, a fourth ground pad 324, and a second signal pad 326.

As further shown in FIG. 3 , the first substrate 310 may connect to thesecond substrate 320 via a set of wire bondings. Additionally, oralternatively, a ribbon bonding may connect first substrate 310 tosecond substrate 320 and cross a wire bonding between signal pad 316 andsignal pad 326. In some implementations, electro-optical device 300 mayinclude a set of components. For example, first substrate 310 may havean optical component 318 and second substrate 320 may have a controlcomponent 328. The optical component 318 may be connected to the controlcomponent 328 via signal pads 316 and 326 and a wire bonding. Forexample, control component 328 may be a signal controller providing highspeed radio frequency signals, such as 70 gigahertz (GHz), 100 GHz, 128GHz, or higher speed RF signals, to optical component 318 via a signalwire connecting signal pads 316 and 326. In some implementations, aninductance associated with the signal wire may be less than a thresholdvalue, such as less than 400 pico-henrys (pH) of inductance.

As shown in FIG. 4A, an S21 response is provided for a firstelectro-optical device that includes wire bondings and no ribbon bondingground and for a second electro-optical device that includes wirebondings and a ribbon bonding ground (e.g., the electro-optical device300). As further shown in FIG. 4A, across a range of frequencies from 0gigahertz GHz to 100 GHz, including a ribbon bonding ground results inimproved S21 performance. For example, at 80 GHz, the firstelectro-optical device has an S21 response of approximately −2.0decibels (dB) and the second electro-optical device has an S21 responseof approximately −1.5 dB. This shows that including a ribbon groundingimproves S21 performance.

As shown in FIGS. 4B and 4C, an S11 and S21 response are provided,respectively, for a first electro-optical device that includes a wirebonding with a ribbon ground, a second electro-optical device thatincludes a wire bonding with a double ribbon ground (e.g., a firstribbon bonding above and a second ribbon bonding below the wirebonding), and a third electro-optical device that includes a wirebonding without a ribbon ground. As further shown in FIGS. 4A and 4B,across a range of frequencies, S11 and S21 performance is improved byincluding a ribbon ground and further improved by including a doubleribbon ground.

As indicated above, FIGS. 3 and 4A-4C are provided as examples. Otherexamples may differ from what is described with regard to FIGS. 3 and4A-4C.

The foregoing disclosure provides illustration and description, but isnot intended to be exhaustive or to limit the implementations to theprecise forms disclosed. Modifications and variations may be made inlight of the above disclosure or may be acquired from practice of theimplementations. Furthermore, any of the implementations describedherein may be combined unless the foregoing disclosure expresslyprovides a reason that one or more implementations may not be combined.

As used herein, satisfying a threshold may, depending on the context,refer to a value being greater than the threshold, greater than or equalto the threshold, less than the threshold, less than or equal to thethreshold, equal to the threshold, not equal to the threshold, or thelike.

Even though particular combinations of features are recited in theclaims and/or disclosed in the specification, these combinations are notintended to limit the disclosure of various implementations. In fact,many of these features may be combined in ways not specifically recitedin the claims and/or disclosed in the specification. Although eachdependent claim listed below may directly depend on only one claim, thedisclosure of various implementations includes each dependent claim incombination with every other claim in the claim set. As used herein, aphrase referring to “at least one of” a list of items refers to anycombination of those items, including single members. As an example, “atleast one of: a, b, or c” is intended to cover a, b, c, a-b, a-c, b-c,and a-b-c, as well as any combination with multiple of the same item.

No element, act, or instruction used herein should be construed ascritical or essential unless explicitly described as such. Also, as usedherein, the articles “a” and “an” are intended to include one or moreitems, and may be used interchangeably with “one or more.” Further, asused herein, the article “the” is intended to include one or more itemsreferenced in connection with the article “the” and may be usedinterchangeably with “the one or more.” Furthermore, as used herein, theterm “set” is intended to include one or more items (e.g., relateditems, unrelated items, or a combination of related and unrelateditems), and may be used interchangeably with “one or more.” Where onlyone item is intended, the phrase “only one” or similar language is used.Also, as used herein, the terms “has,” “have,” “having,” or the like areintended to be open-ended terms. Further, the phrase “based on” isintended to mean “based, at least in part, on” unless explicitly statedotherwise. Also, as used herein, the term “or” is intended to beinclusive when used in a series and may be used interchangeably with“and/or,” unless explicitly stated otherwise (e.g., if used incombination with “either” or “only one of”). Further, spatially relativeterms, such as “below,” “lower,” “above,” “upper,” and the like, may beused herein for ease of description to describe one element or feature'srelationship to another element(s) or feature(s) as illustrated in thefigures. The spatially relative terms are intended to encompassdifferent orientations of the apparatus, device, and/or element in useor operation in addition to the orientation depicted in the figures. Theapparatus may be otherwise oriented (rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein maylikewise be interpreted accordingly.

What is claimed is:
 1. An electro-optical device, comprising: a firstsubstrate including a first set of ground pads and a first signal paddisposed between a first ground pad and a second ground pad of the firstset of ground pads; a second substrate including a second set of groundpads and a second signal pad disposed between a third ground pad and afourth ground pad of the second set of ground pads, wherein the firstground pad is aligned to the third ground pad to form a first ground padpair, the second ground pad is aligned to the fourth ground pad to forma second ground pad pair, and the first signal pad is aligned to thesecond signal pad to form a signal pad pair; a set of wire bondingsincluding a first wire bonding connecting the first ground pad pair, asecond wire bonding connecting the second ground pad pair, and a thirdwire bonding connecting the first signal pad and the second signal pad;an optical emitter associated with the first substrate and electricallyconnected to an electrical signal component associated with the secondsubstrate via the third wire bonding; and a planar ribbon bondingconnecting the first ground pad to the fourth ground pad, wherein theplanar ribbon bonding crosses the third wire bonding without contactingthe third wire bonding.
 2. The electro-optical device of claim 1,wherein the planar ribbon bonding is configured to ground an electricalinductance associated with the third wire bonding.
 3. Theelectro-optical device of claim 1, wherein wire bondings of the set ofwire bondings have a circular cross section and the planar ribbonbonding includes rectangular cross section.
 4. The electro-opticaldevice of claim 1, wherein the planar ribbon bonding is a flexibleconnection.
 5. The electro-optical device of claim 1, wherein the planarribbon bonding does not cross the first wire bonding or the second wirebonding.
 6. The electro-optical device of claim 1, wherein the planarribbon bonding is non-insulated.
 7. The electro-optical device of claim1, wherein the planar ribbon bonding includes at least one of: ametallic material, a dielectric material, or or an insulator material.8. An electro-optical device, comprising: an optical emitter disposed ona first substrate; and a signal controller for the optical emitterdisposed on a second substrate, wherein the first substrate and thesecond substrate include at least one ground pad pair connected by acorresponding at least one ground pad wire bonding, wherein the firstsubstrate and the second substrate include at least one signal pad pairconnected by a corresponding at least one signal pad wire bonding andelectrically connecting the optical emitter to the signal controller,and wherein the first substrate and the second substrate are connectedby at least one planar ribbon bonding from at least one first ground ofthe first substrate to at least one second ground of the secondsubstrate such that the at least one planar ribbon bonding crosses theat least one signal pad wire bonding.
 9. The electro-optical device ofclaim 8, wherein the at least one ground pad pair (G) comprises threeground pad pairs and the at least one signal pad pair (S) comprises twosignal pad pairs in a ground-signal-ground-signal-ground (GSGSG)coplanar structure.
 10. The electro-optical device of claim 9, whereinthe at least one planar ribbon bonding comprises a first planar ribbonbonding crossing a first signal pad pair, of the at least one signal padpair, and a second planar ribbon bonding crossing a second signal padpair of the at least one signal pad pair, and wherein the first planarribbon bonding and the second planar ribbon bonding are bonded to atleast one common ground pad of the at least one ground pad pair.
 11. Theelectro-optical device of claim 9, wherein the at least one planarribbon bonding comprises a first planar ribbon bonding crossing a firstsignal pad pair, of the at least one signal pad pair, and a secondplanar ribbon bonding crossing a second signal pad pair of the at leastone signal pad pair, and wherein the first planar ribbon bonding and thesecond planar ribbon bonding do not share a common ground pad of the atleast one ground pad pair.
 12. The electro-optical device of claim 8,wherein the at least one ground pad pair (G) comprises two ground padpairs and the at least one signal pad pair (S) comprises two signal padpairs in a ground-signal-signal-ground (GSSG) structure.
 13. Theelectro-optical device of claim 8, wherein a first planar ribbonbonding, of the at least one planar ribbon bonding, crosses, withoutcontacting, a second planar ribbon bonding, of the at least one planarribbon bonding.
 14. The electro-optical device of claim 8, wherein theat least one planar ribbon bonding crosses underneath, over-the-top-of,or a combination thereof the at least one signal pad wire bonding. 15.The electro-optical device of claim 8, wherein the at least one signalpad wire bonding is a high speed radio frequency signal wire with aspeed of greater than a first threshold value and an electricalinductance of less than a second threshold value.
 16. Theelectro-optical device of claim 8, wherein a separation between thefirst substrate and the second substrate is less than a thresholdamount.
 17. An electro-optical device, comprising: a first substrateincluding a first ground pad and a first signal pad; a second substrateincluding a second ground pad and a second signal pad, wherein the firstsignal pad and the second signal pad form a signal pad pair, wherein thefirst substrate is separated from the second substrate by less than athreshold amount, wherein the first substrate is configured to receivean optical component and the second substrate is configured to receivean electrical component that is couplable to the optical component via awire bonding between the first signal pad and the second signal pad; anda planar ribbon bonding connecting the first ground pad to the secondground pad and diagonally crossing the wire bonding.
 18. Theelectro-optical device of claim 17, wherein the planar ribbon bondinghas a width to thickness ratio of at least 4:1.
 19. The electro-opticaldevice of claim 17, wherein the first ground pad is disposed on a firstside of the signal pad pair and the second ground pad is disposed on asecond side of the signal pad pair.
 20. The electro-optical device ofclaim 17, wherein a first distance between the first ground pad and thesecond ground pad is greater than a second distance between the firstsignal pad and the second signal pad.